KY8030-2-M

KY8030-2-M

Solder Paste Inspection Equipment by Koh Young America, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    KY8030-2-M
  • Manufacturer
    Koh Young America, Inc

General Parameters

  • Field of View
    30 x 30 mm, 40 x 40 mm, 50 x 50 mm
  • Defects
    Offset, Bridge, Volume, Offset, Shape Deformity, Insufficient Paste, Excessive Paste, Coplanarity
  • PCB Size
    330 x 330 mm
  • PCB Thickness
    0.4 to 5 mm
  • PCB Weight
    2 kg, 5 kg
  • Imaging Speed
    22.5 to 56.1 cm2/sec
  • Height Resolution
    1 μm
  • Camera
    4 MP
  • Lighting
    IR-RGB LED Dome Style Illumination
  • X-Y Axis Resolution
    15 µm, 20 µm, 25 µm
  • Net Weight
    550 kg
  • Overall Dimensions
    820 x 1265 x 985 mm

Technical Documents
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