BM-W630L

BM-W630L

Reflow Soldering Equipment by e-Flex SMT Microsystems, Co. Ltd (4 more products)
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The BM-W630L from e-Flex SMT Microsystems, Co. Ltd is a Reflow Soldering Equipment with Heating Zone Length 2200 mm, Max Pcb Width 300 mm. More details for BM-W630L can be seen below.

Product Specifications

Product Details

  • Part Number
    BM-W630L
  • Manufacturer
    e-Flex SMT Microsystems, Co. Ltd

General Parameters

  • Heating Zones
    6 Zones
  • Heating Zone Length
    2200 mm
  • Max Pcb Width
    300 mm
  • Control Type
    Touchscreen & PLC
  • Conveyor Direction
    Left-to-right
  • Conveyor Height
    900 ±20 mm
  • Conveyor Speed
    0 - 900 mm/min
  • Conveyor Type
    Aluminum rails - Mesh belt (stainless steel) + chain
  • Mesh Belt Width
    330 mm
  • Cooling Method
    3 fans at the exit
  • Heat Type
    Fully Forced Air Convection
  • Power Consumption
    5~8 kw
  • Power Supply
    380V 3 phase, 50 Hz (optional 220V, 3 ph/1 ph, 60 Hz)
  • Startup power
    40 kw
  • Temp Accuracy
    ±1 Degree C
  • Temp Range
    350 Degree C
  • Temperature control precision
    PID close-loop, SSR Drive
  • Net Weight
    680 Kg
  • Overall Dimensions
    3500 x 1000 x 1335 mm

Technical Documents
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