Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance

In overly simple terms, base materials for printed circuits typically consist of three apparently simple components, the copper foil, the resin system, and the reinforcement. However, a closer examination of the materials currently available in each of these categories, as well as a review of the evolution of these materials over the years reveals just how complex base materials can be. Given the many and everincreasing requirements placed on base materials by printed circuit fabricators, printed circuit assemblers, and OEMs, it should come as no surprise that the components and base laminates have become more complex and varied. The challenge to the supplier of base materials is to provide value to the supply chain by balancing the multiple requirements of each level with products that can be produced cost effectively.