TRI to Showcase Semiconductor and Advanced Packaging Inspection Solutions at NEPCON China 2022

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Test Research, the leading test and inspection systems provider for the electronics manufacturing industry, will join the Test & Measurement Pavilion at NEPCON China 2022 held at Shanghai World Expo Exhibition & Convention Center from April 20 – 23, 2022. Visit booth #1J46 to experience Smart Test and Inspection Solutions in action.

Discover TRI's new AI Station capable of optimized continuous inspection deploying AI Models, reducing human errors, false calls, and operator costs. 

TRI will be showcasing the 3D SPI TR7007Q Plus equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. Also exhibiting will be the AI-powered 3D AOI TR7700Q SII with an industry-leading speed of up to 57cm2/sec. TRI's lineup will also include the high-end 3D AXI TR7600F3D SII and the Multi-core ICT TR5001Q SII INLINE.

TRI's staff will be available at the booth to discuss TRI's Semiconductor and Advanced Packaging Industry Inspection Solutions, TRI's latest 3D AOI solutions can inspect Die/wire bonding, underfill, bumps, and more.

TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload. TRI is actively taking part in the development and adaptation of the emerging and pioneers Industry 4.0 and M2M Communication Standards. TRI solutions comply with Industry 4.0 standards like the IPC-Hermes-9852 and the Connected Factory Exchange (IPC-CFX).