Summit Interconnect Appoints David Lane as General Manager and VP of Denver-Based Advanced Assembly

Summit Interconnect Appoints David Lane as General Manager and VP of Denver-Based Advanced Assembly712370

Summit Interconnect, a provider of advanced PCB manufacturing, announced that David Lane recently joined the company as General Manager and Vice President. In this position, he oversees all operations within Summit’s Denver-based facility, Advanced Assembly.

Lane is an industry veteran with over 25 years of hands-on experience in operations and management. He joined Summit Interconnect after serving as the Director of Global Key Accounts at Universal Instruments Corporation, where he played a pivotal role in driving business growth and enhancing customer relationships. Before that, he held key executive positions at Creation Technologies, NEO Technology Solutions (OnCore Manufacturing, LLC.), DDi (Dynamic Details, Inc.), McData Corporation, and Compaq Computers.

“We are thrilled to welcome David Lane to Summit Interconnect as the new General Manager of our assembly division,” said Sean Patterson, COO of Summit Interconnect. “David’s extensive experience and proven leadership will be invaluable assets as we expand our capabilities and continue delivering superior products and services to our customers.”

Throughout his career, David has demonstrated exceptional operations management, business strategy, customer relationship management (CRM), and team leadership skills. He has a long history of building and leading technical organizations, manufacturing operations teams, and cross-functional teams focused on delivering innovative solutions and driving continuous improvement initiatives.

“I am excited to join Summit Interconnect and lead the assembly team,” said David Lane. “I look forward to collaborating with the talented individuals at Summit Interconnect and leveraging our collective expertise to drive innovation, exceed customer expectations, and achieve operational excellence.”

Lane holds a B.S. in Mechanical Engineering from Colorado State University. Advanced Assembly, a Summit Interconnect company, will change its name to Summit Interconnect Assembly later this year.

Click here to learn more about Summit Interconnect.

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Publisher: PCB Directory
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