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Seika Machinery, a provider of advanced machinery, materials, and engineering services, has announced an upcoming webinar focused on solder paste process control. This educational session, part of the Malcom Process Control Webinar series, will be held on July 31st at 10 a.m. PST.
Webinar Details:
Topic: Malcom Process Control Webinar - Session 1: Solder Paste
Cost: Free (Registration required)
Presenter: Charlie Fujikawa, Product Specialist for Malcom Solder Paste Process Control Systems
During the webinar, Charlie Fujikawa, an expert in Malcom solder paste process control systems, will delve into the critical role of solder paste in the Surface Mount Technology (SMT) process. He will explain how various properties of solder paste can significantly impact the reflow process and emphasize the importance of measuring and controlling these properties for optimal performance.
Key topics to be covered include:
In addition, attendees will gain insights into Malcom's state-of-the-art solder paste process control equipment, including:
Click here to Register for the Webinar on Malcom solder paste process control systems.
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