Rogers Corporation's TC Series Laminates, Thermal Management for High-Power Applications

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Rogers Corporation, a global leader in engineered materials for high-performance applications, has introduced its latest innovation - the TC Series laminates for Printed Circuit Boards (PCBs). The TC Series laminates are designed to address the critical thermal management needs of applications requiring high-power RF signals, offering improved performance and reliability in demanding environments.

The TC Series laminates are composed of PTFE, woven fiberglass, and high thermal conductivity ceramic-filled materials. This unique combination provides a range of benefits, including low loss tangent, high thermal conductivity, low coefficient of thermal expansion, and excellent temperature phase stability. As a result, these laminates offer reduced junction temperature, improved reliability, and enhanced thermal dissipation capabilities for high-power applications.

One of the key advantages of the TC Series laminates is their ability to maintain a stable dielectric constant (Dk) even with temperature variations. This characteristic makes them an ideal choice for applications sensitive to Dk changes with temperature, such as power amplifiers, filters, and couplers.

The TC Series includes three high-performance laminates, each catering to specific application requirements:

1. TC350 Laminates: Offering a Dk of 3.50, high thermal conductivity of 0.72 W/m-K, and low TCDk of -9 ppm/°C, TC350 Laminates are well-suited for power amplifiers, communication systems, and thermal solutions.
2. TC350 Plus Laminates: With a Dk of 3.50, high Z-Axis thermal conductivity of 1.24 W/m-K, and low TCDk of -42 ppm/°C, TC350 Plus Laminates are particularly suitable for applications that demand superior thermal management and reliability.
3. TC600 Laminates: Offering a Dk of 6.15, high thermal conductivity of 1.1 W/m-K, and stable TCDk of -75 ppm/°C, TC600™ Laminates are ideal for backhaul radios, thermal solutions, and communication systems.

These laminates also provide reliable attachment to active components and plated vias, ensuring seamless integration within complex PCB designs. Moreover, PCB fabricators can benefit from the processing flexibility offered by the TC Series laminates, enabling optimized panel size and layout.

Click here for more information about the TC Series laminates and their diverse applications.

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