Rigid PCB Market Expected to Grow with CAGR of 4.6%; Multi-Layer to Witness the Highest Growth

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Research and Markets have announced the addition of the "High-Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030" report to their offering. The global high-performance rigid PCB market is expected to grow with a CAGR of 4.6% from 2024 to 2030.

Key Findings

• Multi-layer is expected to witness the highest growth over the forecast period because it consists of several layers of conductive material bonded together with insulating layers and this allows for incredibly complex circuitry with high component density, which is impossible to achieve with single or double-layer boards.
• APAC will remain the largest region over the forecast period because the region is home to major electronics manufacturing hubs like China, Taiwan, and South Korea.

The report delves into various aspects of the global high-performance rigid PCB market, offering insights into market dynamics, trends, and forecasts from 2018 to 2030. It covers key classifications, the supply chain, industry drivers, and challenges. Additionally, the report analyzes macroeconomic trends and forecasts, market trends by type and application, and regional market analysis for North America, Europe, APAC, and the rest of the world. Competitor analysis includes product portfolio assessment, operational integration, and Porter's Five Forces analysis.

Moreover, it identifies growth opportunities, emerging trends, and strategic analysis encompassing new product development, capacity expansion, mergers, acquisitions, and joint ventures. Finally, the report profiles leading players in the market, including Ibiden, PCBMay, TTM, Unimicron Technology, Tripod Technology, AT&S, SEMIKRON, Kinwong, AVARY HOLDING, and HannStar Board.

The future of the global high-performance rigid PCB market looks promising with opportunities in the aerospace, consumer electronics, automobile, communication, medical, and industrial markets. The major drivers for this market are the growing need for high-performance rigid PCBs in a variety of industries, including consumer electronics, automotive, aerospace, and telecommunications, constant technical development and improvements in electronic gadgets, along with the exponential growth of data-centric technologies and applications, including cloud computing, IoT, 5G, and AI.

Companies in the market compete based on product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies performance-rigid PCB companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base.

Features of this Rigid PCB Market report include:

• Market Size Estimates: High-performance rigid PCB market size estimation in terms of value ($B).
• Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.
• Segmentation Analysis: High-performance rigid PCB market size by type, application, and region in terms of value ($B).
• Regional Analysis: High-performance rigid PCB market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the high-performance rigid PCB market.
• Strategic Analysis: This includes M&A, new product development, and the competitive landscape of the high-performance rigid PCB market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

Click here for more information on the "High-Performance Rigid PCB Market Report: Trends, Forecast and Competitive Analysis to 2030" report.

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