PCB WEST 2020 Technical Sessions Announced

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UP Media Group Inc, organizers of the PCB West event, have announced that there will be more than 45 technical sessions at PCB West 2020 this fall. Overall, more than 80 abstracts were submitted for the annual conference, which takes place September 8-11 at the Santa Clara, CA, Convention Center.

This year’s conference features a pair of extended talks from Lee Ritchey on power delivery system design and stackup design, plus three full days of classes from Rick Hartley. The conference covers everything from RF/microwave and mixed-signal design, circuit grounding, understanding material choices, flex circuits, signal and power integrity, to fabrication and assembly processes. Talks are aimed at the spectrum of backgrounds, from novice to advanced.

According to Mike Buetow, PCB West conference director and editorial director, UPMG, the organizers this time around were much more selective with respect to the technical conference. Engineers and designers have limited knowledge of proper grounding, and the event will emphasize that, along with power distribution, to help overcome noise problems associated with power bus design.

For those interested in new component technology, the event will host talks on designing and assembling heterogeneous packages, high-density chip-scale and 3-D packages, and more.

In response to attendee feedback, the technical conference begins each day at 10 a.m. Attendees will also receive certificates indicating the number of hours of training received at PCB West.

On September 9, PCB West will feature 10 free presentations covering the design to assembly spectrum. Highlights include talks on electromagnetic fields, high-speed digital circuits, AI-based smart routers, land pattern design, and thermal management from companies such as Intel, NXP and Analog Devices. 

All free talks will take place on “Free Wednesday,” to complement the one-day exhibition that features more than 100 leading companies. The free keynote address will feature Dr. Brian Toleno, director of new technology at Microsoft, who will speak on Augmented Reality New Device Challenges and Enabling Industry 4.0. The keynote takes place at 11 a.m. on September 11.

PCB West annually provides a conference and exhibition focused on the design and manufacture of PCBs, HDI, electronics assembly and circuit board test. The event annually attracts nearly 2,000 attendees. The event includes a four-day technical conference and one-day exhibition to be held at the Santa Clara (CA) Convention Center in California, USA.