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Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645 from March 20 to 22, 2024.
The MARCH FlexTRAK-CD delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. The ASYMTEK Spectrum and ASYMTEK Vantage fluid dispensing systems are designed for semiconductor packaging and assembly to meet the requirements for dispensing underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly during electronics manufacturing.
Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. Equipment in the booth includes:
Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of electronics manufacturing to enhance efficiency, precision, and reliability across your projects. SEMICON China will be held at the New International Expo Centre, Shanghai, China, March 20 – 23, 2024.
Click here to learn more about Nordson Electronics Solutions.
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