Matrix Electronics Introduces New PCB and IC Substrate Manufacturing Equipment from Advanced Engineering

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Matrix Electronics and Advanced Engineering (AE) has announced the availability of a new generation of automated robot handling and peeler systems for the Printed Circuit Board and Integrated Circuit Substrate manufacturing industries.

Advanced Engineering continues to impress the PCB industry with its inventive PCB and now IC Substrate automation solutions. Offering a complete automation equipment and software solution from their specialized shop in Hallein, Austria, the AE engineering teams are focused on accelerating production for their customers with consistency and accuracy.

“We are impressed with the willingness of North American PCB manufacturers to adopt and ramp up automation in their plants. The PCB industry is strong in North America and Matrix is looking for innovative ways to support the growth of our customers,” says Kieran Healy, President of Matrix Electronics. “New equipment designs from Advanced Engineering including the MOJO, Servant, and Peeler devices take PCB manufacturing to the next level for our customers. This advanced automation approach to PCB manufacturing reduces costs, and ensures consistency and quality while optimizing plant capacity.”

Advanced Engineering harnesses the latest software and component technology from well-known manufacturers such as BECKHOFF, SICK, KEYENCE, PILZ, and FESTO. All machines link directly to an MES or ERP system, giving customers superior data collection and reporting. The intelligence gathered from these systems is fed back into process engineering to optimize the productivity and efficiency of the line.

“Advanced Engineering is focused on innovation with our new approach to PCB and IC Substrates Manufacturing Automation. At Advanced Engineering, we worked from the ground up to Re-imagine, Re-define, and Re-invent our equipment offering to provide lasting excellence in automated equipment and software solutions for our customers,” says Advanced Engineering CEO Johannes Steinberger. “The result is an innovative, cleaner, faster, and more robust industry 4.0 compliant PCB automation manufacturing solution.”

Reduced power consumption, HEPA filtration, along with an updated touch panel interface powered by easily customizable “Line Controller” Software are important integrations in the Advanced Engineering lineup. Several Laser Direct Imaging (LDI), Automated Optical Inspection (AOI), Inkjet, Loaders and Unloaders, Buffer systems, and Develop Etch, Strip (DES) and Strip, Etch, Strip (SES) lines can be directly linked to the Line Controller making complex processes simple while bridging the gap between automated machinery and a Manufacturing Execution System (MES).

Click here to learn more about Advanced Engineering.