Indium to Present its Innovative Products for HIA and SiP at IMAPS Device Packaging 2023

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Indium will feature its innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13 - 16, in Fountain Hills, AZ.

Indium's proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. The newly released SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

As the industry leader in no-clean semiconductor flux, Indium will feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow, at the level of Indium's proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

Indium will also feature Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Additionally, Indium will showcase QuickSinter®, a high metal content paste, redefining sinter technology. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers' specific application needs.

Click here to know more about Indium's semiconductor flux.

Click here to know more about Avoid the Void.

Click here for more details about IMAPS Device Packing Conference 2023.