Indium to Feature Metal TIMs For Burn-In and Test at TestConX 2023

Indium to Feature Metal TIMs For Burn-In and Test at TestConX 2023712370

Indium will feature its high-performance metal thermal interface materials (TIMs) for burn-in and test at TestConX, March 5-8 in Mesa, Ariz., U.S. Indium Corporation will feature selections from its portfolio of innovative high-performance metal TIM solutions.

Indium's indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK. Its indium-containing TIMs are available as pure indium, indium-silver alloys, and indium-tin, among others. The pure indium TIM can be clad with a thin aluminum layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface. Indium Corporation's suite of Heat-Spring® solutions, featuring a compressible interface between a heat source and a heat-sink, include:

Heat-Spring® Preforms

  1. Patterned to optimize contact with non-planar surfaces delivering 86W/mK
  2. Provides uniform contact between the burn-in head and the DUT
  3. Provides more uniform thermal conductivity
  4. Cleans with no residue
  5. Recyclable and reclaimable

Heat-Spring® HSK

  1. Recommended specifically for burn-in applications where multiple insertions are required
  2. Provides uniform contact with low resistance for high-density heat loads
  3. Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
  4. No staining or cracking

Heat-Spring® HSD

  1. Designed for interfaces with tight surface control >30psi
  2. Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces.

Click here to know more about Metals Thermal Interface Materials (TIMs).

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Publisher: PCB Directory
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