IDTechEx Explores Advanced Semiconductor Packaging Technologies: 2.5D and 3D Insights

https://cdn.pcbdirectory.com/news/jnxz_638405607159211772.png712370

IDTechEx has released a new report titled, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", which thoroughly explores the latest innovations in semiconductor packaging technology, covering key technical trends, analyzing the value chain, evaluating major players, and providing detailed market forecasts.

The report recognizes the crucial role of advanced semiconductor packaging as the foundation for next-generation ICs. It focuses on its applications in key markets such as AI and data centers, 5G, autonomous vehicles, and consumer electronics. Leveraging IDTechEx's expertise in these sectors, the report delivers a comprehensive understanding of the impact and future trajectory of advanced semiconductor packaging in these critical fields.

Semiconductor packaging technologies have evolved from initial 1D PCB levels to cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.

Four critical parameters shape advanced semiconductor packaging: power, performance, area, and cost:

1. Power: Enhancing power efficiency through innovative packaging technologies.
2. Performance: Boosting bandwidth and reducing communication length by shortening interconnection pitch for more input/output (I/O) points.
3. Area:  A larger packaging area is required for chips used in high-performance computing areas, whereas smaller z-form factors are required for 3D integration.
4. Cost: Continuously reducing packaging costs by employing alternative, more affordable materials or enhancing manufacturing equipment efficiency

2.5D and 3D Packaging Technologies:

In the realm of 2.5D and 3D packaging technologies, various methods are employed for effective integration. In 2.5D packaging, interposer material choices include Si-based, Organic-based, and glass-based interposers. The figure above illustrates these options. In contrast, 3D packaging focuses on evolving microbump technology to achieve smaller pitch dimensions. The adoption of hybrid bonding technology, directly connecting Cu-Cu, represents a significant advancement enabling single-digit pitch dimensions today.

Advantages and Drawbacks in 2.5D and 3D Configurations:

2.5D

1. Si: Two alternatives exist in Si-based packaging - the Si interposer, using a full passive Si wafer, and the Si bridge, either in a localized form within a fan-out-based molding compound or a substrate with a cavity. The Si interposer excels in facilitating fine routing features but faces challenges related to cost and limited packaging area. The localized Si bridge form is gaining prominence, strategically utilizing Si where necessary.
2. Organic: Organic-based packaging using a fan-out molding compound is a cost-effective alternative to silicon, offering lower RC delay in the package due to adjustable dielectric constants. However, challenges exist in achieving the same interconnect feature reduction as Si-based packages.
3. Glass: The glass-based approach, exemplified by Intel's recent test vehicle package, offers tunable CTE, dimensional stability, and a smooth surface. While glass has potential as an interposer rivaling silicon, its immature ecosystem and limited mass production capability in the packaging industry pose current drawbacks. As the ecosystem matures, the use of glass-based technologies may expand.

3D

1. Microbump: Established microbump technology, based on the Thermal Compression Bonding (TCB) process, is prevalent but faces challenges with scaled bumping pitch. Smaller solder ball sizes result in increased Intermetallic Compounds (IMCs), impacting conductivity and mechanical properties. Close contact gaps may lead to solder ball bridging, posing risks during reflow.
2. Hybrid Bonding: Involving permanent interconnections through a dielectric material (SiO2) with embedded metal (Cu), hybrid bonding achieves pitches below 10 micrometers, expanding I/O, increasing bandwidth, enhancing 3D vertical stacking, and improving power efficiency. Challenges include manufacturing complexities and higher costs associated with this advanced technique.

Key aspects of this report:

Exploring Technology Trends and Manufacturers in Advanced Semiconductor Packaging:

• Explore advanced semiconductor packaging evolution, addressing transistor IC challenges. Examine how chiplet concepts and heterogeneous integration propel advanced packaging adoption.
• Analyze Packaging Technologies: Segment by interposer material (Si, Glass, Organic), covering roadmaps, benchmarks, applications, players, and manufacturing barriers.
• Company Analysis: In-depth examination of key companies, assessing solutions, clientele, applications, and technology roadmap.
• Key Markets: Provide detailed overviews for critical markets - high-performance computing, autonomous vehicles, 5G, and consumer electronics.
• Case Studies: Showcase various industry applications of advanced semiconductor packaging.
• Supply Chain & Models: Analyze supply chain dynamics and business models in this evolving landscape.

10-year Granular Market Forecasts & Analysis:

• Data Center Server Unit Forecast 2023-2034 (Shipment)
• Data Center CPU: Advanced Semiconductor Packaging Forecast 2023-2034 (Shipment)
• Data Center Accelerator: Semiconductor Packaging Forecast 2023-2034 (Shipment)
• 2.5D Semiconductor Packaging for L4+ Autonomous Vehicles 2023-2045
• 3D Semiconductor Packaging for L4+ Autonomous Vehicles 2023-2045
• Consumer Electronics Unit Sales Forecast 2023-2034 (Smartphones/Tablets/Smartwatches/AR/VR/MR)
• Advanced Semiconductor Packaging Forecast for APE in Consumer Electronics 2023-2034
• Global PC Shipment Forecast 2023-2034
• Advanced Semiconductor Packaging in PC Forecast 2023-2034
• 5G Radios by MIMO Size Unit Forecast 2023-2034
• Advanced Semiconductor Packaging for 5G RAN Networks 2023-2034

Free-to-attend upcoming webinar

Advancement in 2.5D and 3D Semiconductor Packaging Technologies

Dr Yu-Han Chang, Senior Technology Analyst at IDTechEx and author of this article will be presenting a free-to-attend webinar on the topic on Wednesday 17 January 2024 - Advancement in 2.5D and 3D Semiconductor Packaging Technologies.

This webinar will reveal insights into 2.5D and 3D advanced semiconductor packaging technologies and the content include:

• 2.5D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
• 3D advanced semiconductor packaging technologies: current status, existing barriers, future development trend, target markets, player analysis
• Market outlook for 2.5D and 3D packaging technologies

Click here to find out more and register your place on one of the three sessions.

Click here to find out more about this new IDTechEx report, including downloadable sample pages.