GOEPEL Electronics Launches New High-Speed 3D Solder Paste Inspection System

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GOEPEL Electronic, a German test and measurement equipment manufacturer, has launched a new 3D solder paste inspection system called Vario Line, 3D SPI. The new system is based on the hardware platform of the company's automated optical inspection (AOI) product family, Vario Line. It features a high-speed 3D inspection module based on fringe projection technology, which ensures maximum reliability and reproducibility. With the Vario Line · 3D SPI, it is now possible to assess the quality of the solder paste print and inspect sintered pastes with structure heights of only 30 µm.

The new inspection system offers an extended inspection range and higher speed, and a closed-loop interface that enables direct networking to paste printers or placement machines. It has a link to PILOT Connect, which is the uniform networking system for all inspection data from AOI, SPI, and AXI. This common interface ensures the central recording and management of the machine and operating data of all connected inspection systems.

According to Dr. Jörg Schambach, product manager for SPI systems at GÖPEL Electronic, "the reliable detection and evaluation of criteria for printed pads such as height, area, volume, offset, and paste bridges is an essential building block for ensuring the quality of assembled PCBs produced in SMD lines. But the Vario Line · 3D SPI is much more than just a system for defect detection."

He further explained that the potential of solder paste inspection lies in the fact that process fluctuations can be automatically corrected by networking with other systems in the SMD production line. This ultimately leads to the best possible optimized production process in which product quality is permanently increased.

The Vario Line, 3D SPI is also equipped with an AI advisor software module that serves as an AI-based assistance function of the verification software. This feature offers further options for reducing manufacturing efforts. All inspection information can be brought together on one verification and repair station, which opens up secure error assessment and new possibilities for optimizing the production process.

Overall, the Vario Line, 3D SPI represents an innovative system solution for the 3D inspection of solder and sintering pastes. It is suitable for a wide range of applications and will undoubtedly be a valuable addition to the production processes of many companies.

Click here to get the Datasheet for the Vario Line, 3D SPI.

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