Cadence's AI-Powered Solutions in Collaboration with Broadcom Set New Quality Standards

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Cadence Design Systems has revealed a strategic partnership with Broadcom aimed at integrating cutting-edge AI-driven design methodologies for expediting the development of their groundbreaking 3nm and 5nm designs. By leveraging Cadence's AI-driven Cerebrus™ Intelligent Chip Explorer, multiple divisions within Broadcom have realized significant enhancements in performance, power efficiency, and design area. Given the intricate nature and scale of Broadcom's product designs at advanced semiconductor nodes, the incorporation of AI technology stands as a transformative solution to meet ambitious time-to-tapeout objectives.

Due to the advanced capabilities of Cadence Cerebrus, Broadcom has been able to automate tasks through AI, for improving final design data and turnaround time. For example, the floorplan exploration capability helps automatically determine the optimal chip design floorplan, saving PPA. The AI model reuse capability enables Broadcom to apply previous design learnings to their next-generation designs, reducing the time to optimized results. Finally, the easy-to-use interface provides interactive analytics, offering valuable insights into design data and easy debug.

“We use a wide portfolio of Cadence solutions across our business units, and we have seen outstanding PPA improvements from the use of the AI capabilities of Cadence Cerebrus,” said Yuan Xing Lee, Vice President and Head of Central Engineering, Broadcom. “Over the last year, we have seen accelerated adoption of Cadence Cerebrus AI technology across multiple business units within Broadcom and we look forward to taking advantage of this technology in our next generation of products. Cadence has been a key silicon design partner for many years now, and we look forward to continuing to work together to achieve our design goals and deliver high-quality designs to customers.”

“With the AI-driven capabilities of Cadence Cerebrus, Broadcom successfully reduced manual tasks so they could focus on higher-impact, strategic work while meeting PPA goals,” said Dr. Chin-Chi Teng, Senior Vice President and General Manager, Digital & Signoff Group, Cadence. “Today’s designs are very complex, and through our continued collaboration, we are working together to ensure that Broadcom is able to utilize our AI capabilities to deliver compelling designs to market faster.”

Click here to learn more about Candence's Cerebrus Intelligent Chip Explorer.