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Cadence Design Systems and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics. This collaboration significantly advances system and semiconductor design for AI, automotive, aerospace, hyperscale, and mobile applications and has resulted in the following recent technology achievements:
“We have a distinguished track record collaborating with TSMC to deliver a broad set of innovations across EDA, packaging, and IP to accelerate system and semiconductor design and enable customers to achieve aggressive time-to-market goals,” said Chin-Chi Teng, SVP and GM, of R&D, Cadence. “These new certified design flows and standardized solutions allow customers to confidently design for TSMC advanced nodes and usher in improved design efficiency and technological advancements.”
“TSMC works closely with Cadence to accelerate customer innovation by providing high-quality design tools certified for use with our most advanced processes,” said Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC. “Through our longstanding collaboration, we’re able to deliver greater value for the most advanced SoC designs, benefiting from the significant power and performance boost afforded by our latest technology innovations.”
Click here to learn more about Cadence Design Systems.
Click here to learn more about TSMC.
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