ASC's Ultra High-Density Interconnect Program Revolutionizing the Electronics Industry

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American Standard Circuits (ASC), a leading player in the North American electronics industry, is making waves with its innovative technology for developing Printed Circuit Boards (PCBs) requiring ultra-high-density interconnects. The company has been an early licensee of Averatek Corporation's patented A-SAP™ Technology, which has enabled ASC to produce ultra-fine lines and spaces in any board technology, including rigid, flex, and rigid-flex.

ASC's Ultra High-Density Interconnect program has been designed to offer several design advantages, including size and weight reduction, tight spacing and impedance control, reduced layer count, and improved signal integrity. The program's aspect ratios are greater than 1:1 for metal traces, and its RF performance is better than traditional subtractive-etch processes. Additionally, ASC's technology allows the use of biocompatible materials such as gold and other noble metals, thereby reducing costs, especially for complex, high-performance boards.

Currently, ASC builds down to 20 microns (0.8 mils) trace and space with 12.5 microns (0.5 mils) trace and space available later this year. However, the company plans to further step down into the 15-micron range in 2023. ASC's Ultra High-Density Interconnect program offers several capabilities, including sub-25 micron lines and spaces, available on board types such as rigid, flex, and rigid-flex, and all material types. The program also offers hybrid constructions using ultra-fine line features on select layers and standard technology on others, micro vias to 75 microns with copper filling, and tight impedance tolerances, resulting in improved signal integrity.

ASC's innovative technology is set to revolutionize the electronics industry, as it offers significant design advantages, reduced costs, and improved performance compared to traditional subtractive-etch processes. With the company's plans to further step down into the 15-micron range, the future looks promising for ASC and its Ultra High-Density Interconnect program

Click here to read more about ASC's UHDI program.

While click here to learn more about HDI PCBs.