The IWLPC (International Wafer-Level Packaging Conference) brings together the semiconductor industry’s most respected authorities to address all aspects of wafer-level, 3D device packaging, advanced manufacturing & test technologies. This premier industry event explores leading-edge design, material, and process technologies being applied to wafer-level packaging applications. This year, there will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, opto-electronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR
