Hosted by the International Microelectronics Assembly and Packaging Society (IMAPS), International Symposium on Microelectronics (IMAPS 2020) will be hosting its 53rd edition this year. The event focuses primarily on the progress on technologies throughout the entire microelectronics/packaging supply chain. The event symposium this year will feature 5 technical tracks, plus an Interactive Poster Session, that span the three days of sessions on - SiP/SiM/CPI (System Solutions), Wafer Level/Panel Level (Advanced RDL), High Performance / High Reliability, Advanced Package (Flip Chip, Heterogeneous Integration, 2.5D, 3D, Optical), Advanced Process & Materials (Enabling Technologies).
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