TXV-CH4090FD

The TXV-CH4090FD from Toshiba IT & Control Systems is an X-ray Inspection System designed for image analysis, image measurement, function replay, making movie files, and pitch movement function. It has a flat panel detector with a wide dynamic range and can obtain fluoroscopic images that are not easily affected by halation. The image analysis options allow the detection of pseudo-color, check profile, histogram, and 3D images. This X-ray inspection system incorporates Toshiba’s X-ray sensing technology and is an easy-to-use model for inspecting chip circuit boards, inspecting solder on-chip circuit boards and providing clear images of BGAs and soldering conditions. It supports image measurement options including die attach measuring (includes shading function), wire sweep, 2-point measurement, measurement of void ratios, and BGA void calculation.

The TXV-CH4090FD is equipped with a close tube with a maximum tube voltage of 90 kV and a minimum focal dimension of 5 μm. It can operate on an area of 400 x 350 mm and magnifies images by a factor of 153. In addition to the X, Y and Z-axis, the tilt axis enables fluoroscopic observation from an oblique direction. The sample table moves in the X-Y axis direction, and the X-ray generator and X-ray sensor integrated mechanism moves in the Z-axis and tilt axis, respectively.