BLF061

BLF061

Solder Paste by SOLDER CHEMISTRY (16 more products)

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Product Specifications

Product Details

  • Part Number
    BLF061
  • Manufacturer
    SOLDER CHEMISTRY

General Parameters

  • Type
    Lead Free
  • Flux Type
    Water Soluble
  • Alloy
    SnAgCu
  • Alloy Composition
    Sn95.5/Ag3.8/Cu0.7
  • Metal Content
    0.9
  • Particle Size
    20 - 38 µm
  • Melting Point
    217 Degree C
  • Package Type
    Jar
  • Shelf Life
    6 Months
  • Storage Temperature
    20 Degree C
  • Net Weight
    200 g, 500 g

Technical Documents

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