BBI-LFSP

BBI-LFSP

Solder Paste by Shenzhen BBIEN Technology Co.,Ltd (20 more products)

Note: Your request will be directed to Shenzhen BBIEN Technology Co.,Ltd

Product Specifications

Product Details

  • Part Number
    BBI-LFSP
  • Manufacturer
    Shenzhen BBIEN Technology Co.,Ltd

General Parameters

  • Type
    Lead Free
  • Flux Type
    No-Clean
  • Alloy
    SnBiAg
  • Alloy Composition
    Sn42Bi57Ag1
  • Particle Size
    T3(25 - 45 µm), T4(25 - 38 µm)
  • Melting Point
    180 Degree C
  • Package Type
    Syringe, Jar
  • RoHS
    Yes
  • Shelf Life
    6 Months
  • Net Weight
    50 g, 500 g

Technical Documents

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