96.5SN/3.0AG/0.5CU

96.5SN/3.0AG/0.5CU

Solder Paste by Shenzhen BBIEN Technology Co.,Ltd (20 more products)
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Product Specifications

Product Details

  • Part Number
    96.5SN/3.0AG/0.5CU
  • Manufacturer
    Shenzhen BBIEN Technology Co.,Ltd

General Parameters

  • Type
    Lead Free
  • Flux Type
    Water Soluble
  • Alloy
    SnAgCu
  • Alloy Composition
    Sn96.5Ag3.0Cu0.5
  • Particle Size
    T3(25 - 45 µm), T4(25 - 38 µm), T5(15 - 25 µm), T6(10 - 18 µm), T7(5 - 12 µm)
  • Package Type
    Syringe, Jar
  • Shelf Life
    6 Months
  • Net Weight
    100 g, 500g

Technical Documents
View more details on the manufacturer's website
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