Typical TSC Reflow Profile II

Typical TSC Reflow Profile II

Solder Paste by MBO (UK) Ltd (20 more products)

Note: Your request will be directed to MBO (UK) Ltd

Product Specifications

Product Details

  • Part Number
    Typical TSC Reflow Profile II
  • Manufacturer
    MBO (UK) Ltd

General Parameters

  • Type
    Lead Free
  • Alloy
    SnAgCu
  • Alloy Composition
    Sn96.5Ag3.0Cu0.5
  • Package Type
    Cartridge, Jar
  • Net Weight
    250 g, 500 g, 1 kg

Technical Documents

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