ALPHA WS-698CPS

The ALPHA WS-698CPS from MacDermid Alpha Electronics Solutions is a Water-Soluble Solder Paste. It is RoHS-compatible and has a chemical composition of an alloy of Tin (96.5%), Silver (3%), and Copper (0.5%). This solder paste has an average melting temperature range from 217 to 225°C. It comes in two variants with an average particle size of Type 4 and Type 6. This solder paste is designed for stencil printing application for either surface-mount or solder bumping process. It is formulated to deliver excellent visual joint cosmetics and has the additional capability of IPC Class III for voiding ensuring maximum long-term product reliability. 

The ALPHA WS-698CPS maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25 mm (0.010”) with 0.100 mm (4miL) stencil thickness. It has excellent print consistency with a high process capability index across all board designs and reduces random solder balling levels, minimizing rework and increasing first-time yield. This solder paste is available in jars or cartridges, has a shelf life of 6 months, and should be stored at a temperature from 0 to 8°C.