ALPHA OM-362

The ALPHA OM-362 from MacDermid Alpha is a Lead-free Solder Paste that is composed of an alloy of Tin (96.5%), Copper (0.5%), and Silver (3%). It uses a no-clean flux, which helps in leaving a clean flux residue during the soldering process. This paste has an optimum melting point of 217°C. It achieves IPC Class III voiding on BGA components, maintaining an average voiding of less than 10% on Bottom Terminated Components (BTC). The solder paste has a Type 4 average particle size and delivers ultra-low voiding performance, especially when used with high-reliability alloys like Innolot and traditional SAC alloys. It exhibits excellent electromigration characteristics, coalescence and wetting performance, and solder joint and flux residue cosmetics. 

The ALPHA OM-362 is formulated to be zero-halogen, ensuring environmental friendliness and safety in usage. It is available in jars and cartridges with a shelf life of 4 months and should be stored in temperature from 0 to 10°C.