Indium8.9HFA

Indium8.9HFA

Solder Paste by Indium Corporation (33 more products)

Note: Your request will be directed to Indium Corporation

Product Specifications

Product Details

  • Part Number
    Indium8.9HFA
  • Manufacturer
    Indium Corporation

General Parameters

  • Type
    Lead Free
  • Flux Type
    No-Clean
  • Alloy
    SnAgCu, SnAg
  • Alloy Composition
    Sn96.5/Ag3.0/Cu0.5
  • Metal Content
    0.885
  • Particle Size
    T3, T4
  • Package Type
    Jar, Cartridge
  • Shelf Life
    6 Months
  • Storage Temperature
    < 10°C
  • Net Weight
    500 g, 600 g

Technical Documents

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