SMDLTLFP500T3

SMDLTLFP500T3

Solder Paste by Chip Quik Inc. (132 more products)

Note: Your request will be directed to Chip Quik Inc.

Product Specifications

Product Details

  • Part Number
    SMDLTLFP500T3
  • Manufacturer
    Chip Quik Inc.

General Parameters

  • Type
    Lead Free
  • Flux Type
    No-Clean
  • Alloy
    BiSnAg
  • Alloy Composition
    Bi57.6Sn42Ag0.4
  • Metal Content
    90% metal by weight.
  • Particle Size
    T3 (25-45 microns)
  • Melting Point
    281°F (138°C)
  • Package Type
    Jar
  • RoHS
    Yes
  • Shelf Life
    6 Month
  • Storage Temperature
    37°F ~ 46°F (3°C ~ 8°C)
  • Net Weight
    17.64 oz (500g)

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