Note: Your request will be directed to Viscom AG
The iS6052 SPI from Viscom AG is a Solder Paste Inspection Equipment that is designed for in-line manufacturing. It has one orthogonal camera and four angled-view cameras for shadow-free 3D inspections. These cameras have a resolution of 12 &mum and a FOV of 58 mm x 58 mm. They have a Z resolution of 0.1 &mum and a Z range of up to 5 mm. It has a system computer with an Intel Core i7 processor and delivers an inspection speed of 80 cm2/s. This system can accommodate PCBs 508 x 508 mm in size with a thickness of 900-950 mm.
The iS6052 SPI can inspect solder paste deposits (stencil printing or dispensing technology, up to pad sizes for 01005 components), sinter paste, adhesives, surface, height, print displacement, smearing, shape, coplanarity, open area analysis, OCR and DMC. It has a footprint of 1753 x 997 x 1756 mm and supports SMEMA & Hermes interfaces. It is ideal for solder and sinter paste inspection applications.
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