ISO-Spector S31

ISO-Spector S31

Solder Paste Inspection Equipment by MEK Americas LLC (4 more products)

Note: Your request will be directed to MEK Americas LLC

The ISO-Spector S31 from MEK Americas LLC is a Full 3D Solder Paste Inspection Equipment. It has a CMOS Mono Camera that operates on phase shift, hybrid inspection, 2D ring light, and 3D projector(s) inspection principles. The outline of the solder paste is extracted through the use of the 360-degree ring light that projects against inspection objects (solder paste). This method of inspection isolates solder paste on the PCB and performs 3D measurements to achieve more reliable inspections. The camera and the dual projectors combine to create multiple captured samples using a strip pattern and calculate the relative height of the solder paste.  

The ISO-Spector S31 has an inspection camera with a switchable resolution of 25/12.5/8.5 &mum, 20/10/7 &mum, 15/7.5/5 &mum or 10/5 &mum, an inspection speed of up to 9400 mm2/s and a FOV size of 20 x 20 mm to 50 x 50 mm. It can accommodate PCBs with dimensions ranging from 50 x 50 to 510 x 510 mm with a PCB thickness of 0.3-5.0 mm. This system measures the PCB warpage during the inspection and adjusts the height of the camera automatically to compensate for the PCB warpage. 

The ISO-Spector S31 can generate live SPC data for printing trends and distribution histograms, enabling fast diagnosis of printing issues. It can detect solder smear and PCB contamination outside aperture detection and also has a glue detection option to check the correct glue application for wave-soldered SMT applications. This system is ideal for factory automation, Industry 4.0, and quality improvement applications.

Product Specifications

Product Details

  • Part Number
    ISO-Spector S31
  • Manufacturer
    MEK Americas LLC
  • Description
    Full 3D Solder Paste Inspection Equipment for PCB Dimensions up to 510 x 510 mm

General Parameters

  • Field of View
    50 x 50 mm
  • Defects
    Coplanarity, Volume, Height, Bridging, Insufficient solder, foreign material
  • PCB Size
    50 x 50 - 510 x 510 mm
  • PCB Thickness
    0.3 - 5 mm
  • PCB Weight
    Less than 5kg
  • Imaging Resolution
    25/12.5/8.5 um
  • Height Resolution
    1 µm
  • Camera
    CMOS Mono Camera - Global shutter spec.
  • Top Clearance
    5 mm
  • Bottom Clearance
    30 m
  • Edge Clearance
    4 mm
  • Conveyor Height
    900 ± 20 mm
  • Net Weight
    600 kg
  • Overall Dimensions
    938 x 1191 x 1480 mm

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