KY8030-3-M

KY8030-3-M

Solder Paste Inspection Equipment by Koh Young America, Inc (9 more products)
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Product Specifications

Product Details

  • Part Number
    KY8030-3-M
  • Manufacturer
    Koh Young America, Inc

General Parameters

  • Field of View
    35.3 x 25.9 mm
  • Defects
    Offset, Bridge, Volume, Offset, Shape Deformity, Insufficient Paste, Excessive Paste, Coplanarity
  • PCB Size
    330 x 250 mm
  • PCB Thickness
    0.4 to 4 mm
  • PCB Weight
    1 kg
  • Imaging Speed
    91.2 cm2/sec
  • Height Resolution
    1.5 μm
  • Camera
    4 MP
  • Bottom Clearance
    30 mm
  • X-Y Axis Resolution
    15 µm, 20 µm
  • Z-Axis Resolution
    0.37 µm
  • Net Weight
    500 kg
  • Overall Dimensions
    1000 x 800 x 1570 mm

Technical Documents
View more details on the manufacturer's website
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