SQ3000-X

The SQ3000-X from CyberOptics Corporation is a Solder Paste Inspection Equipment with powerful tools that cover inspection and measurement for AOI, SPI and CMM applications. It features a high-resolution imaging system, that captures PCB details with its 810 µm MRS Sensor and 7 µm ultra high-resolution MRS Sensor that uses White LED lighting + RGB. The machine has an imaging speed of 40 sq. cm./sec (2D+3D) with is a high-speed option available that has an imaging speed of 50 sq. cm./sec (2D+3D, MRS sensor), and 15 sq. cm./sec (2D+3D) (ultra high-resolution MRS sensor). It can support PCBs up to net weight of 10Kg with PCB dimensions ranging from 50 x 120 mm (MRS Sensor) to 720 x 620 mm (Ultra High-Resolution MRS Sensor), while the thickness can vary from 0.3 to 5 mm. The minimum edge clearance is 3 mm, with top clearance at 50 mm and bottom clearance at 30 mm. 

The SQ3000-X  has Multi-Reflection Suppression (MRS) sensor which ensures metrology-grade accuracy by eliminating reflections from shiny components. This technology, coupled with high-speed inspection, delivers microscopic image quality at production pace. The intuitive software minimizes training efforts and operator interaction while facilitating feedback and feed forward capabilities with key vendors, optimizing the production line. It uses the innovative CyberPrint Optimizer analyzes trend data for proactive process enhancement, reducing downtime. It is available in an enclosure that measures 134 x 139 x 139 cm, while the weight of the model is 2738 lbs.