REFLOW-X8

REFLOW-X8

Reflow Soldering Equipment by Shenzhen Eton Automation Equipment Co., Ltd (5 more products)

Note: Your request will be directed to Shenzhen Eton Automation Equipment Co., Ltd

The REFLOW-X8 from Shenzhen Eton Automation Equipment Co., Ltd is a Reflow Soldering Equipment with Heating Zone Length 3000 mm, Max Pcb Width 350 mm. More details for REFLOW-X8 can be seen below.

Product Specifications

Product Details

  • Part Number
    REFLOW-X8
  • Manufacturer
    Shenzhen Eton Automation Equipment Co., Ltd

General Parameters

  • Cooling Zones
    2 Zones
  • Heating Zones
    8 Zones
  • Heating Zone Length
    3000 mm
  • Max Pcb Width
    350 mm
  • Component Height
    25 mm
  • Conveyor Direction
    Left-to-right ( Optional R to L )
  • Conveyor Height
    900±20 mm
  • Conveyor Speed
    0 to 1800 mm/min
  • Exhausting Flow Per Port
    25 m³/min
  • Power Consumption
    7 kW
  • Power Supply
    380 V,3 PH , 50 Hz
  • Startup power
    45 kW
  • Temp Accuracy
    ±1 Degree C
  • Temp Range
    350 Degree C
  • Temperature control precision
    PID Temprature Control
  • Temperature deviation on PCB
    ±2 Degree C
  • Net Weight
    1400 kg
  • Overall Dimensions
    4800 x 1200 x 1450 mm

Technical Documents

Web Analytics