Note: Your request will be directed to SEHO Systems GmbH
The GoReflow 1.8 from SEHO Systems GmbH is a Reflow Soldering Equipment with Heating Zone Length 1850 mm, Max Pcb Width 410 mm. More details for GoReflow 1.8 can be seen below.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
OR
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
Create an account on PCB-Directory to claim your profile.
