GSD-GB822

GSD-GB822

Reflow Soldering Equipment by GrandSeed (Hong Kong) International Co.,Ltd (11 more products)
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The GSD-GB822 from GrandSeed (Hong Kong) International Co.,Ltd is a Reflow Soldering Equipment with Heating Zone Length 3550 mm, Max Pcb Width 50 to 400 mm. More details for GSD-GB822 can be seen below.

Product Specifications

Product Details

  • Part Number
    GSD-GB822
  • Manufacturer
    GrandSeed (Hong Kong) International Co.,Ltd

General Parameters

  • Cooling Zones
    2 Zones
  • Heating Zones
    24 Zones
  • Heating Zone Length
    3550 mm
  • Max Pcb Width
    50 to 400 mm
  • Control Type
    Computer, PLC/Special MCU
  • Conveyor Direction
    Left to Right
  • Conveyor Speed
    0 to 2000 mm/min
  • Conveyor Type
    Chain + Mesh
  • Mesh Belt Width
    460 mm
  • Cooling Method
    Forced Air Cooling
  • Heat Type
    Convection
  • Power Consumption
    8 kW (Normal Operating Power)
  • Power Supply
    A3ø380V 50HZ
  • Startup power
    93 kW (Total Power)
  • Temp Accuracy
    ±1 to 2 Degree C
  • Temp Range
    350 Degree C
  • Temperature control precision
    PID
  • Temperature deviation on PCB
    ±2 Degree C
  • Net Weight
    2800 kg
  • Overall Dimensions
    6880 x 1500 x 1550 mm (L x W x H)

Technical Documents
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