SMT-H3

SMT-H3

Reflow Soldering Equipment by Beijing Borui Precision Electronics Technology Co., Ltd (4 more products)

Note: Your request will be directed to Beijing Borui Precision Electronics Technology Co., Ltd

The SMT-H3 from Beijing Borui Precision Electronics Technology Co., Ltd is a Reflow Soldering Equipment with Heating Zone Length 1000 mm, Max Pcb Width 300 mm. More details for SMT-H3 can be seen below.

Product Specifications

Product Details

  • Part Number
    SMT-H3
  • Manufacturer
    Beijing Borui Precision Electronics Technology Co., Ltd

General Parameters

  • Cooling Zones
    2 Zones
  • Heating Zones
    2 Zones, 3 Zones
  • Heating Zone Length
    1000 mm
  • Max Pcb Width
    300 mm
  • Conveyor Direction
    Left to Right
  • Conveyor Height
    880±20 mm
  • Conveyor Speed
    0 to 2200 mm/min
  • Cooling Method
    Air Cooling
  • Heat Type
    Full Hot Air
  • Power Consumption
    2 kW
  • Power Supply
    220 VAC
  • Startup power
    7 kW
  • Temp Accuracy
    ±2 Degree C
  • Temp Range
    310 Degree C
  • Temperature control precision
    PID + SSR
  • Temperature deviation on PCB
    ±2 Degree C
  • Net Weight
    200 kg
  • Overall Dimensions
    2000 x 650 x 1400 mm(L x W x H)

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