MAGTREX 555

The MAGTREX 555 from Rogers Corporation is a PCB Laminate which has high-temperature efficiency and suitability for high-frequency applications. It is designed for a variety of PCB needs with a decomposition temperature (Td) of 500°C and a coefficient of thermal expansion of 22.25 ppm/°C (on the X-Y axis) and 25 ppm/°C (on the Z-axis). This laminate has a thermal coefficient of approximately +1000 ppm/°C and a thermal conductivity of 0.47 W/mK which facilitates efficient heat dissipation. It is engineered with a proprietary blend of low loss ceramic filler and high-temperature thermoplastic matrix, providing controlled permeability and permittivity. This unique composition enables antenna designers to enhance their design flexibility, allowing for optimized antenna performance.

The MAGTREX 555 is available in dimension of 305 x 457 mm with various thickness options from 1.02 to 5.08 mm, providing flexibility to accommodate diverse design requirements. It has a dimensional stability of 0.18% and can withstand pressure of up to 10.8 MPa (1.57 ksi) which helps maintain structural integrity. This laminate ensures secure bonding with a peel strength of 3.1 lbs/in and a Poissons ratio of 0.3685 MPa (ksi) that prevents breakage or malfunctioning. It offers closely matched X/Y axis permeability and permittivity (6 and 6.5 respectively) and exhibit low magnetic and dielectric loss below 500 MHz.