MCL-I-671

MCL-I-671

PCB Laminates by Resonac Corporation (12 more products)
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The MCL-I-671 from Resonac Corporation is a PCB Laminates with Tg 230 to 245 Degree C. More details for MCL-I-671 can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-I-671
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp
  • Tg
    230 to 245 Degree C
  • Applications
    Main frame computers and super computers, Semiconductor testing equipment, and burn-in boards, Flex-rigid PWBs
  • Cte xy
    12 to 15 ppm/Degree C, 12 to 16 ppm/Degree C
  • Cte z
    50 to 80 ppm/Degree C, 200 to 300 ppm/Degree C
  • Material
    Polyimide, FR-4
  • Peel strength
    1.3 to 1.5 kN/m, 1.0 to 1.2 kN/m
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    1.60 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 330 to 350 Degree C, Flexural Modulus - 24 to 26 Gpa

Technical Documents
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