MCL-HS200

MCL-HS200

PCB Laminates by Resonac Corporation (12 more products)
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The MCL-HS200 from Resonac Corporation is a PCB Laminates with Dk 3.7, Df 0.0040, Tg 250 to 270 Degree C. More details for MCL-HS200 can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-HS200
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp, Halogen-free
  • Dk
    3.7
  • Df
    0.0040
  • Tg
    250 to 270 Degree C
  • Halogen Free
    Yes
  • Applications
    Packages, Thinner Module PWB
  • Cte xy
    8 to 10 ppm/Degree C
  • Cte z
    25 to 35 ppm/Degree C, 140 to 200 ppm/Degree C
  • Peel strength
    0.7 to 0.9 kN/m, 0.8 to 1 kN/m
  • Size
    14 x 14 mm
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    0.045 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 410 to 430 Degree C, Flexural Modulus - 21 to 26 Gpa

Technical Documents
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