MCL-HS100

MCL-HS100

PCB Laminates by Resonac Corporation (12 more products)
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The MCL-HS100 from Resonac Corporation is a PCB Laminates with Dk 3.7, Df 0.0040, Tg 240 to 260 Degree C. More details for MCL-HS100 can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-HS100
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp, Halogen-free
  • Dk
    3.7
  • Df
    0.0040
  • Tg
    240 to 260 Degree C
  • Halogen Free
    Yes
  • Applications
    Semiconductor packages. (FC-CSP, PoP, SiP), Thinner Module PWB
  • Cte xy
    6 to 8 ppm/Degree C
  • Cte z
    20 to 30 ppm/Degree C, 130 to 180 ppm/Degree C
  • Peel strength
    0.5 to 0.7 kN/m
  • Size
    14 x 14 mm
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    0.40 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 430 to 450 Degree C, Flexural Modulus - 23 to 28 Gpa

Technical Documents
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