MCL-E-679FGB

MCL-E-679FGB

PCB Laminates by Resonac Corporation (12 more products)
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The MCL-E-679FGB from Resonac Corporation is a PCB Laminates with Tg 200 to 220 Degree C. More details for MCL-E-679FGB can be seen below.

Product Specifications

Product Details

  • Part Number
    MCL-E-679FGB
  • Manufacturer
    Resonac Corporation

General Parameters

  • Type
    High Temp, Halogen-free
  • Tg
    200 to 220 Degree C
  • Halogen Free
    Yes
  • Applications
    Semiconductor packages. (FC-BGA, BGA, CSP), Build up PWB, Personal computer, high density electronic equipment
  • Cte xy
    13 to 15 ppm/Degree C
  • Cte z
    23 to 33 ppm/Degree C, 140 to 170 ppm/Degree C
  • Material
    FR-4
  • Peel strength
    0.9 to 1.1 kN/m, 1 to 1.2 kN/m
  • Surface resistivity
    1 x 1013 to 1 x 1015 ohms
  • Thickness mm
    0.8 mm
  • Volume resistivity
    1 x 1014 to 1 x 1016 ohms-cm
  • Note :
    Decomposition Temp - 340 to 360 Degree C, Flexural Modulus - 23 to 28 Gpa

Technical Documents
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