TerraGreen 400G

TerraGreen 400G

PCB Laminates by Isola Group (28 more products)

Note: Your request will be directed to Isola Group

The TerraGreen 400G from Isola Group is a Halogen-free PCB Laminate Material that has a glass transition temperature (Tg) of 215°C. It is based on a novel resin and uses ultra-smooth HVLP3(VLP1) copper foil with low Dk glass engineered for very high data rates of over 100 Gb/s. This laminate material has a thermal conductivity of 0.54 W/m·K and a decomposition temperature (Td) of over 380°C. It has a permittivity (Dk) of 3.15 and a loss tangent (Df) of 0.0017. This material is lead-free compatible, sequential lamination capable, and can be processed utilizing standard PCB equipment and processing steps. It is compatible with the FR-4 process & HDI technology and can withstand multiple lamination cycles. This laminate is available in 2 to 10 mil (0.05 to 0.25 mm) offerings and is ideal for next-generation 5G infrastructure, data center systems, high-end computing, wired & wireless communications, and AI applications.

Product Specifications

Product Details

  • Part Number
    TerraGreen 400G
  • Manufacturer
    Isola Group
  • Description
    Halogen-free PCB Laminate Material with Tg of 215°C

General Parameters

  • Type
    Halogen-free
  • Dk
    3.15
  • Df
    0.0017
  • Td
    380 Degree C
  • Tg
    200 Degree C
  • UL
    Yes
  • Halogen Free
    Yes
  • Arc resistance
    180 sec
  • Cte xy
    12-13 ppm/Degree C
  • Cte z
    37, 170 ppm/Degree C
  • RoHS
    Yes
  • CTI
    250 - 499 V
  • Dielectric breakdown
    70 kV
  • Electrical strength
    67 kV/mm
  • Flamibility
    V-0
  • Industry application
    Automotive, Aerospace and Defence, Networking
  • Material
    FR-4
  • Moisture absorbtion
    0.001
  • Peel strength
    0.7 N/mm
  • Poissons ratio
    0.17, 0.22
  • Surface resistivity
    2.0 x 107 Mohms
  • Thermal conductivity
    0.54 W/mK
  • Volume resistivity
    2.0 x 108 Mohms-cm
  • Youngs modulus
    14.5, 13.0 Mpa

Technical Documents

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