Pyralux TK Bond Ply

Pyralux TK Bond Ply from DuPont are PCB Laminates constructed of Fluoropolymer/Polyimide material clad by high-quality copper on both of its sides. The laminates are ideal for high-speed and high-frequency flexible circuit applications. They have a low dielectric constant (Dk) between 2.3 to 2.6 that aids in its high-frequency operations by storing minimal electrical energy and not hindering signal transmission. DuPont has also made sure that the laminates have a low dissipation factor (Df) between 0 to 0.0015 that prevents signal loss due to the inherent dissipation of electromagnetic energy in the substrate. The laminates aid high-frequency operations between a range of DC to 10 GHz with excellent bond strength assuring a highly robust electronic assembly. It has a peel strength of 1.2 (7.0) when received, a strength of 1.2 (7.0) after solder, and a strength of 0.2 (7.0) after HAST, all of them tested under IPC-TM-650 2.4.9.

The copper clad used by Pyralux TK Bond Ply is certified to IPC 4203A/13 and is available in dielectric thicknesses of 2, 3, and 4 mils. It has two copper types called RA, and ED that are certified to IPC 4203A/5 that encapsulate two etched details for environmental protection and electrical insulation. Using Bondply can eliminate a layer of Kapton and a layer of adhesive in low-count multilayer constructions and has no tack that helps in ease of registration/ The laminates are lead-free, and hence certified by RoHS, and found application in Aerospace and Defense, Industrial, and Military industries.