3000C

3000C

Depaneling Equipment by Hetsub Technology Co., Ltd (12 more products)

Note: Your request will be directed to Hetsub Technology Co., Ltd

Product Specifications

Product Details

  • Part Number
    3000C
  • Manufacturer
    Hetsub Technology Co., Ltd

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Thickness
    0.8 to 3 mm
  • Separating Speed
    100 mm/sec
  • Working Area
    330 x 350 mm
  • Air Pressure
    5 to 6 bar
  • Power Supply
    3-phase AC 220 V ±5 % 50 Hz / 60 Hz, 4.0 kw
  • Net Weight
    680 kg
  • Overall Dimensions
    1974 x 1120 x 1720 mm

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