DIVISIO 5100 Dual

DIVISIO 5100 Dual

Depaneling Equipment by Asys Group Americas Inc (10 more products)
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Product Specifications

Product Details

  • Part Number
    DIVISIO 5100 Dual
  • Manufacturer
    Asys Group Americas Inc

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Thickness
    0.8 to 5.0 mm
  • Max Board Length
    70 to 330 mm
  • Max Board Width
    50 to 250 mm
  • Max Component Height
    40 mm
  • Power Supply
    400 V, 208V 50 / 60 Hz, ± 10%
  • Net Weight
    1900 kg
  • Overall Dimensions
    1200 x 2396 x 3032 mm

Technical Documents
View more details on the manufacturer's website
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