DIVISIO 2300

DIVISIO 2300

Depaneling Equipment by Asys Group Americas Inc (10 more products)
Download Brochure Request Quote

Note: Your request will be directed to Asys Group Americas Inc

Product Specifications

Product Details

  • Part Number
    DIVISIO 2300
  • Manufacturer
    Asys Group Americas Inc

General Parameters

  • Depaneling Mode
    Motorized
  • PCB Thickness
    0.5 to 4.5 mm
  • Max Board Length
    50 to 720 mm
  • Max Board Width
    50 to 500 mm
  • Max Component Height
    40 mm
  • Power Supply
    400 V, 208 V 50 / 60 Hz, ± 10%
  • Net Weight
    1150 kg
  • Overall Dimensions
    1880 x 2796 x 1522 mm

Technical Documents
View more details on the manufacturer's website
Web Analytics