Note: Your request will be directed to Viscom AG
The S3016 Ultra from Viscom AG is a 3D Solder Joint Inspection Machine for the bottom sides of PCBs. It is designed for rapid and high-precision inspection of selective solder joints as well as SMD, press-fit and THT components. This inspection machine is equipped with an 8 MP camera and has a resolution of 15 µm to deliver clear and detailed images of the inspected PCBs. It has an inspection speed of up to 65 cm2/s and ensures greatest inspection depth even under extreme cycle time requirements and versatile illuminations can be tuned to the specific task. In addition to measuring pins, Viscom inspection algorithms also enable fast detection of open solder joints, solder bridges, missing pins and other defects.
The S3016 Ultra has a conveyor height from 950 to 1000 mm and can handle a wide range of PCB sizes. It is powered by Windows OS and an Intel Core™ i7 and delivers efficient and reliable performance. This machine is available in an enclosure that measures 1094 x 1620 x 1692 mm and requires an AC supply.
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