iS6059

The iS6059 from Viscom is an Automated Optical Inspection (AOI) System that uses XMu-II 3D sensor technology to inspect the bottom side of PCBs. This AOI system has eight angled cameras to produce shadow-free images with a resolution of 13 µm. It has an inspection speed of up to 65 sq. cm./s and a field of view of 50 x 50 mm. This AOI equipment can handle PCB sizes up to 508 x 560 mm and can inspect solder joints for THT, SMD, and press-fit components.  

The iS6059 has an automatic pneumatic clamping conveyor with a transport height range of 850 to 950 mm. It has a footprint of 1100 x 1756 x 1753 mm and is ideal for inspecting selective/wave soldering and standard solder joints according to IPC standards.