Xceed BSI Large

Xceed BSI Large

Automated Optical Inspection (AOI) Equipment by PARMI (7 more products)
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Product Specifications

Product Details

  • Part Number
    Xceed BSI Large
  • Manufacturer
    PARMI

General Parameters

  • PCB Size
    510 x 610 mm
  • Camera
    4 MP
  • Inspection Speed
    85 sq.cm/sec
  • Defect Analysis
    Shape, Height, Bridging, Insufficient Solder, Excessive Solder
  • Conveyor Height
    860 to 970 mm
  • Lighting
    R. G. B. 3 Stage Independent Lightings
  • PCB Thickness
    1 to 12 mm
  • PCB Weight
    10 kg
  • Power Supply
    1~N, PE, 230 V, 50/60 Hz
  • Top Clearance
    100 mm
  • Bottom Clearance
    59 mm
  • Edge Clearance Top
    4 mm
  • Edge Clearance Bottom
    4.1 mm
  • X-Y Axis Resolution
    16.7 × 16.7 µm
  • Net Weight
    800 kg
  • Machine Dimension
    1130 x 1505 x 1573 mm

Technical Documents
View more details on the manufacturer's website
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